材料及构件失效分析
● 成分定性分析 Qualitative analysis of composition
● 成分定量分析 Quantitative analysis of composition
● 断面分析 Cross section analysis
● 腐蚀老化失效分析 Corrosion aging failure analysis
● 磨损断裂机理分析 Analysis of wear and fracture mechanism
● 异物分析 Foreign matter analysis
● 微观结构分析
电子元器件失效分析
● 显微镜(2D/3D)观察 Microscope (2d/3d) observation
● 开封 Decap
● 目视检查 Visual inspection
● 引线键合强度 bonding wire strenght
● 取晶粒 Bare die Extraction
● 激光切割 Laser cutting
● 芯片粘结强度 The bonding strength of the chip
● 去金凸块 De-Gold Bump
● 静电放电(ESD)测试 Static discharge(ESD)test
● 芯片去层 Delsyer
● 红墨水试验 Dye&Pry test
● 探针测试 Probe test
● 背面研磨 Backside Polishing
● FIB-线路修补 FIB-line repair
● LCR测试 LCR test
● 高解析度显微拍照 High resolution micrograph
● X射线透视 X-Ray
● I-V曲线量测 I-V curve measurement
● 横截面切片 Cross section slice
● BGA(PCB)&IC电路提图服务 BGA(PCB)&IC circuit Titus service
● 扫描电镜应用 SEM/EDS application
● OBIRCH 应用 OBIRCH application
● EMMILC 液晶热点侦测 EMMILC liquid crystal hot spot detection
● 超声波扫描分析 C-SAM analysis
● 焊点分析 Solder joint analysis
● 可焊性 Weldability
● 回流焊模拟 Simulation of reflow welding
● 红外光谱 Infrared spectrum
● 离子污染 Ionic contamination
● 颗粒物清洁度 Cleanliness of particulate matter
● 应变测试 Strain test
● 锡须评估 Tin whisker evaluation